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As a material that is ubiquitous from high-tech industries to everyday life, ceramics have a wide range of applications in a variety of industries and in ways that go unnoticed by users. From vapor phase synthesis, 3D printing and sintering of ceramics to cutting, drilling and micro-structuring of precision ceramics, laser processing is now widely used. In contrast to this more sophisticated high-tech laser processing, we specialize in personalized and traceable laser marking and engraving on ceramic products or components.
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What Should You Know About Ceramic Laser Marking or Engraving?
At present, we mainly use UV laser systems for marking and engraving ceramics. Its short wavelength of 355nm allows it to be absorbed by all kinds of elemental materials, thus realizing stable and fine marking and engraving on ceramic substrates of all kinds of compositions. In addition to conventional DPSS lasers, high-speed femtosecond or picosecond class UV laser sources can be used, which can realize pure black marking or high-speed deep engraving due to their shorter pulse duration and higher single pulse energy.
In addition, with CNC control, multi-axis motion module, using beam expander and high-speed UV laser, can greatly improve the efficiency of engraving, punching and cutting, has been widely used in the production of precision ceramics and processing. Its higher single pulse energy can vaporize the processed parts faster, preventing local melting resulting in lower cutting or engraving efficiency, while its energy is more concentrated spot is smaller, which can achieve 50 micron or lower micro-hole processing.
CO2 lasers are the more popular choice, with the advantage that the 1.06 micron wavelength is efficiently absorbed by engineering ceramics such as alumina, which combined with the relatively high power makes them more effective than UV lasers for deep engraving, punching and cutting. However, because the Heat Affect Zone (HAZ) is much larger than with UV lasers, more precise control of power and parameters is required to avoid cracking and chipping of the ceramic substrate, localized melting, vitrification and carbonization.
In addition, CO2 lasers are also widely used for surface hardening of ceramics, which is based on the principle of rapid heating and cooling to induce internal phase and tissue changes. By properly adjusting the power, scanning speed, spot size and cooling rate of the ceramic workpiece, the porosity of the ceramic workpiece can be reduced and its mechanical properties such as hardness can be improved.
Fiber lasers have gradually replaced CO2 lasers in the processing of ceramics of some compositions, its 1064nm wavelength characteristics make its spot smaller than CO2 lasers, the beam quality is higher, and the power is similar or even higher, combined with the advantages of its lifetime and reliability, so in the appropriate ceramic materials can be compared to the CO2 laser marking, engraving, punching and cutting better and more efficient. However, different elements have different acceptance efficiencies for these lasers, resulting in some ceramics can not use fiber lasers or require pre-treatment such as glaze removal.
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